GeniusWay | Plating the Future
A Leading Provider of Semiconductor Electroplating Equipment and Solutions in China
Crafted with Precision | Driven by Innovation
GeniusWay horizontal electroplating equipment is a core solution for advanced packaging, power devices, and compound semiconductor manufacturing. It supports key processes including TSV, Pillar, Bump, and RDL, enabling chip miniaturization and high-performance upgrades.
About GeniusWay
A Subsidiary of Laplace Group
Jiangsu Wuxi GeniusWay Semiconductor Technology Co., Ltd., established in 2024 and located in Xishan District, Wuxi, Jiangsu Province, is backed by a core R&D team consisting of foreign experts from globally leading equipment enterprises, overseas-returned PhDs and master’s graduates. The company specializes in semiconductor electroplating equipment, focusing on advanced packaging electroplating processes such as TSV, micro-bump, and RDL, and is committed to becoming a global leader in high-end semiconductor equipment and integrated solutions.
公司成立
2020
年
装备机位
20
个
百级&千级洁净间
1500
㎡
Honors and Qualifications
- Jiangsu Private Technology Enterprise
- 70 Invention Patents
- 4 Utility Model Patents
- 3 Software Copyrights