Genius Way | Plating the Future
In chip manufacturing, metal interconnects are like a crisscrossing network of ‘meridians,’ and high-end electroplating is the key process that precisely ‘weaves’ this core network.
Crafted with Precision | Driven by Innovation
The Explora 3D is core equipment for advanced packaging, power devices, and compound semiconductor manufacturing, covering key processes such as TSV, Pillar, Bump, and RDL, helping chips achieve miniaturization and high-performance upgrades.
About Genius Way
Genius Way’s core R&D team includes several foreign experts from globally top equipment companies and overseas returnees with master’s and doctoral degrees. They deeply cultivate the semiconductor electroplating equipment business, focusing on electroplating processes for advanced packaging such as TSV, micro-bumps, and RDL, striving to become a global leader in high-end semiconductor equipment and total solutions.
Honors and Qualifications
- Jiangsu Private Technology Enterprise
- 70 Invention Patents
- 4 Utility Model Patents
- 3 Software Copyrights